HDI

2 N 2 HDI

Classification:

HDI and FR4 Platforms

Key words:

Product Details

		Capability
		Normal	Advanced
1	Product Thickness, Min./Max. (mm)	0.5-3.6	0.3-4.0
2	Min. Dielectric Thickness (mm)	0.050	0.040
3	Max.Inner/Outer Layer Copper Thickness (oz.)	2/2	3/2
4	Min. Inner Layer Line Width/Spacing (mm),@H Oz Cu	0.065/0.065	0.050/0.050
5	Min.Outer Layer Line Width/Spacing (mm), @ 1 Oz Cu	0.090/0.090	0.075/0.075
6	Min. Laser/Mechanical Driling Hole Diameter (mm)	0.075/0.15	0.075/0.15
7	Max.Hole Aspect Ratio of Laser/Mechanical @ 0.15mm Drill Bit	0.75:1/8:1	0.90:1/10:1
8	Laser Capture/Target Pad size(mm)	D 0.15/D 0.2	D 0.125/D 0.175
9	Press Fit Hole Diameter Tolerance (mm)	0.09/-0	0.09/-0
10	Min.Solder Mask Bridge Width (mm)	0.075	0.075
11	Min. Solder Mask Window (mm)	0.038	0.038
12	Hole to Hole Tolerance (mm)	±0.05	±0.05
13	Min.Hole to PAD Tolerance (mm)	±0.035	±0.035
14	Min. PAD/Hole to Breakage Tolerance (mm)	±0.05	±0.05
15	Min.Routing Depth Tolerance (mm)	±0.05	±0.05
16	Shape Processing	CNC Routing/ Punching/ Laser Cut

Our metal-based PCBs offer excellent electrical conductivity, high heat dissipation and superior stability. It provides unparalleled reliability and durability to meet your needs in a variety of complex environments. Our products are not only of high quality, but also proud of our accurate production process and advanced production technology. By choosing our metal-based PCBs, you will have an excellent solution to ensure that your equipment runs efficiently.

Related Products

MHE901RN

Embedded Ceramic Multi-layered PCB

MHE901RC-4L

Embedded Copper Multi-layered PCB

MHE901RC-2L

Embedded Copper Multi-layered PCB

MHE301RC

Pedestal Copper Multi-layered IMS

MHE301RV-2L

Thermal Via Multi-layered IMS

MHE301RV