MHE301RC

Pedestal Copper Multi-layered IMS

Classification:

Hot metal based platform

Key words:

Product Details

Item
1	Pedestal Size (mm)	Min: 0.6*0.6
2	Pedestal to Pedestal distance (mm)	≥ 1.5
3	Pedestal to Outer Layer Circuit Pads(mm)	Min:0.25mm for 10Z/min:0.35mm for 20Z
4	Pedestal to Inner Layer Circuit Pads(mm)	≥ 0.35
5	Pedestal Height-H(mm)	0.135-0.22	0.20-0.29	0.135-0.22
6	Dielectric thickness(mm)	0.10-0.15	0.08-0.13	0.10-0.15
7	Core Thickness(mm)	/	0.05-0.10	/
8	Pedestal Pad Flatness (one)	RA≤0.6,The flatness is ≤10
9	Height Difference between Pedestal Pad and Circuit Trace (one)	Normal≤30,Min:10
10	Final Board Thickness(mm)	1.0/1.2/1.5/2.0/3.0
11	Min. Line Width & Spacing(mm), @ 1 Oz Cu	0.1/0.1
12	Max.number of circuit layer	4

Our metal-based PCBs offer excellent electrical conductivity, high heat dissipation and superior stability. It provides unparalleled reliability and durability to meet your needs in a variety of complex environments. Our products are not only of high quality, but also proud of our accurate production process and advanced production technology. By choosing our metal-based PCBs, you will have an excellent solution to ensure that your equipment runs efficiently.

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