技术

技术

Technologies

Micro Heat Exchanger (MHE)

With patented Technologies, micro-structures are implanted in the PCB to quickly export heat from high-power devices/chips to the heat sink.

 

MHE技术

MHE901RC/RN

● Embedded ceramic/copper up to 8-layer interconnect stack up structure 

● Provides an unique rapid thermal path for LED/MOSFET/IGBT without affecting the temperature and efficiency of surrounding circuits 

● HDI process can be easily incorporated to enhance overall performance 

● Enables smaller circuit board designs and reduces the number of PCBs

● Applications: Adaptive Driving Beam (ADB), On-Board Charger (OBC), LiDAR

● Application: Adaptive high beam (ADB), on-board charger (OBC), laser radar (LiDAR)
MHE技术

MHE301RC

● copper pedestal, multi-layer stacked  structure 
● IMS with copper base for rapid heat spreading 
● Fully, directly, and closely attached to high-power chips/devices for the fastest thermal conduction 
● Applications: Automotive Head-Up Display (AR-HUD), Automotive Headlights
MHE技术

 

MHE301RV

● HDI laser thermal via multi-layer stacked structure
● IMS with copper base for rapid heat spreading
● Thermal vias are directly attached to high-power chips/devices 
● Solves the thermal conduction and gap limitations between electrodes of high-power devices 
● Applications: Adaptive Driving Beam (ADB)

 

MHE901-Achieving System Miniaturization and Enhanced Assembly Reliability

 

● Construct fast vertical heat conduction path for high power components such as MOSFET / LED / IGBT →

● Eliminate thermal effects on surrounding diodes/inductors/capacitors

● Integration of HDI/HLC and high thermal conductivity advantages to reduce the number of circuit boards

Achieve smaller circuit board design, effectively reducing the number of circuit board design

● Remove external wiring to reduce assembly costs

● Firmly fixed on the radiator

MHE技术

 

 

.MHE技术

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