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MHE 901 Platform
Embedded Ceramic Multi-layered PCB
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Embedded Copper Multi-layered PCB
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Thermal Via Multi-layered IMS
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
IMS with high thermal conductivity (2-10 W/mK) dielectric layer
HDI and FR4 Platform
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