RAYBEN Group invested a new factory in JiangXi, a strategic move into PCB automation, capacity expansion and sustainable development.

RAYBEN Group invested a new factory in JiangXi, a strategic move into PCB automation, capacity expansion and sustainable development.


Release time:

2025-03-10

In order to cater capacity expansion and automation to achieve sustainable company growth, RAYBEN Group had been investigating the feasibility of second production base in recently years.  With detailed evaluation and discussion with our strategic partner for win-win situation, RAYBEN had officially completed the full acquisition of Ganzhou Zhirong Circuit Co., Ltd. on February 20, 2025 and introduced their senior professional team to join RAYBEN Group.  Signing ceremony was successfully launched under the witness of the senior officials from Longnan City and related departments, marking a big step  forward for RAYBEN Group on larger production capacity and more efficient production towards automotive PCB application and other high end electronics applications.

RAYBEN Group’s acquisition and the new built factory are key components of the group's strategic blueprint.  It helps not only for larger production capacity, but also allows clear production line definition to enable automation feasible. All-in-all, such move enables shorter production cycle, better product quality and more focus on innovation on PCB integration.

“Innovation, Quality, and Service” are the key mandate for the success of RAYBEN.  We will continue to invest in R&D, product quality and production efficiency, to support and provide a satisfactory experience to our customers and partners.

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Why do you need a thermally conductive substrate?

The thermally conductive substrate helps the electronic components to effectively dissipate heat and keep the chip temperature at an optimal level, so that its performance and product life will not be affected during operation. In addition, the better the performance of the thermally conductive substrate, the less bulky the heat dissipation system. Therefore, the thermal conductive substrate with good performance better supports the miniaturization of the electronic system. RAYBEN provides a wide range of thermal substrate solutions, including FR4 thermal vias, traditional high thermal conductivity metal core PCB, base copper metal core PCB, embedded copper or ceramic FR4 to meet different thermal dissipation needs.

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